Tailoring the Surface Characteristics of CuSe Thin Films by Adjusting the Compositional Ratio

Using radio frequency (RF) magnetron cosputtering, copper selenide thin films (TFs) with various ratios of Se are fabricated herein. To observe how the chemical and physical properties change based on morphology, the ratio of metallic Cu to nonmetallic Se is tuned to form multiple different compositions. The compositional percentage of the surface is determined by X-ray photoelectron spectroscopy (XPS). Noticeable transitions of the characteristics of TFs are affected by Cu to a higher degree than Se. Larger grain sizes are observed when the Se ratio is high in Cu-rich TFs. Most copper selenide TFs are hydrophobic and portray these characteristics the strongest when the surface Se ratio of TF is 16.62% as the contact angle with distilled water is 129 degrees. In addition, the electrical conductivity is the highest at 2.04 (+/- 0.13) x 10(7) S m(-1) when the surface Se ratio is 10.95%.

Automated summary

The chemical and physical properties of copper selenide thin films are influenced by the ratio of metallic copper and non-metallic selenium, with copper having a greater impact on the film characteristics. Larger grain sizes are observed when the selenium ratio is high. The hydrophobicity of most copper selenide thin films is strongest when the surface selenium ratio is 16.62%.