期刊
JOURNAL OF MOLECULAR LIQUIDS
卷 338, 期 -, 页码 -出版社
ELSEVIER
DOI: 10.1016/j.molliq.2021.116675
关键词
Adsorption; Corrosion resistance; Copper; Ionic liquid molecule; Molecular aggregation
资金
- NSFC of China [21376282, 21676035, 21878029]
- Chongqing Science and Technology Commission [cstc2018jcyjAX0668]
- Graduate Student Research Innovation Project, Chongqing University [CYB18046]
- China Postdoctoral Science Foundation [22012T50762, 2011M501388]
This study proposes using the molecular aggregation method of organic ionic liquid molecules (OILMs) to enhance adsorption and corrosion inhibition on copper surfaces in sulfuric acid solution. Three new single imidazole-type OILMs with long carbon chains were synthesized and characterized, demonstrating regular molecular assembly in sulfuric acid solution. The formed OILMs aggregates exhibited good chemical adsorption on copper surfaces, forming hydrophobic adsorption layers and showing excellent corrosion resistance in sulfuric acid solution.
This study proposes to use molecular aggregation method of organic ionic liquid molecules (OILMs) to intensify adsorption and corrosion inhibition to copper surface in sulfuric acid solution. Three new single imidazole-type OILMs including long carbon chain were synthesized, which were characterized by different methods such as nuclear magnetic resonance (NMR) and elemental analysis. The results suggest that the OILMs could process regular molecular assembly in sulfuric acid solution. The formed OILMs aggregates have been shown dependence on the OILMs concentrations and aggregation time. The chemistry adsorption of the OILMs aggregates on copper surface was demonstrated by various means including attenuated total reflection infrared spectroscopy (ATR-IR), X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and spectroscopic ellipsometry and contacting angles, and atomic force microscopy (AFM) as well as scanning electron microscopy (SEM) imaging. Thus, the hydrophobic adsorption layers of the OILMs aggregates were yielded on copper surface. The electrochemistry survey suggests that the OILMs aggregates present nice corrosion resistance effect to copper in sulfuric acid solution (the maximal corrosion inhibition efficiency, >93%). The results were further understood by the theoretical simulation computation. (C) 2021 Elsevier B.V. All rights reserved.
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