期刊
JOURNAL OF MOLECULAR GRAPHICS & MODELLING
卷 106, 期 -, 页码 -出版社
ELSEVIER SCIENCE INC
DOI: 10.1016/j.jmgm.2021.107907
关键词
Electronic properties; Chemical bonding; Density functional theory
类别
资金
- National Natural Science Foundation of China [21776004]
In this study, the geometries, electronic properties, and chemical bonding of (VH2)n (n =10-30) nanoclusters were systematically investigated using a combination of artificial bee colony optimization with density functional theory calculations. The results indicate that the coordination numbers of V-H fluctuate significantly in the nanoclusters, and there is a large overlap between the d orbitals of V atoms and the s orbitals of H atoms, forming sigma bonds.
The geometries, electronic properties, and chemical bonding of (VH2)(n) (n =10-30) nanoclusters are systematically investigated by a combination of artificial bee colony optimization with density functional theory calculations. Structure analysis indicates that the structures of (VH2)(n) nanoclusters tend to be a disorder, where the hydrogen atoms prefer to occupy the hollow sites among different V atoms, binding three V atoms to form the HV3 moieties. The bond length suggests that the average V-V bond lengths are about 2.60 angstrom, and the average V-H bond lengths are near 1.86 angstrom, which close to the experimental values of 2.77 angstrom and 1.79 angstrom for the V-V and V-H of bulk vanadium hydride, respectively. Interestingly, the coordination numbers of V-H fluctuate around 5.50 in the nanoclusters, and the corresponding value of H-V is estimated at 3.00. Moreover, the electronic properties and chemical bonding analyses indicate that d orbitals of V atoms and s orbitals of H atoms have a relatively large overlap to form sigma bonds. Specifically, the sigma molecular orbital of H-2 can donate electronic density to the d orbital of V atom, exhibiting the Kubas interaction in V24H48 and V29H58 nanoclusters. Kubas interaction results in a longer bond between the hydrogen molecule and the V atom. (C) 2021 Elsevier Inc. All rights reserved.
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