4.6 Article

A flexible composite phase change material with ultrahigh stretchability for thermal management in wearable electronics

期刊

JOURNAL OF MATERIALS SCIENCE
卷 56, 期 28, 页码 15937-15949

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SPRINGER
DOI: 10.1007/s10853-021-06290-6

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资金

  1. Zhejiang Provincial Natural Science Foundation of China [LQ21E030002]
  2. Hangzhou City Agriculture and Social Development General Project [20201203B118]

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A novel flexible composite PCMs with ultrahigh extensibility was developed by encapsulating paraffin@copper microcapsules in a silicone elastomer matrix. The composite PCMs exhibit superior flexibility, thermal reliability, and thermal protection for biological tissue, making them ideal for thermal management in wearable electronics.
Application of phase change materials (PCMs)-based thermal management technology in flexible electronic devices has been inhibited due to the leakage and strong rigidity of PCMs. A novel flexible composite PCMs with ultrahigh extensibility was developed in this paper. Concretely, a kind of paraffin@copper (PA@Cu) microcapsule with paraffin as core and nano-Cu particle as flexible metal shell was prepared by a simple Pickering emulsion method in an aqueous medium. The encapsulation ratio of paraffin reached 98wt%. Then the PA@Cu microcapsules were introduced into uncured liquid silicone to fabricate flexible composite PCMs (PA@Cu/SE). SEM results demonstrated that the microcapsules were tightly and uniformly wrapped in the three-dimensional network structure of silicone elastomer matrix. Owing to the good compatibility of PA@Cu with the polymer elastomer and a barrier for the melted PA provided by the flexible nano-Cu shell, the resulting composite PCMs present superior flexibility and thermal reliability. Tensile tests showed that the flexible composites with a relative higher loading of PA@Cu (40wt%) exhibit outstandingly larger extensibility (> 730%) than many reported literatures. In addition, the composites presenting superior thermal protection for biological tissue make them well-suited for thermal management in wearable electronics. [GRAPHICS] .

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