Highly anisotropic thermal conductivity of mesogenic epoxy resin film through orientation control

To develop insulating materials with a high thermally conductive anisotropy, planarly aligned mesogenic epoxy (ME) resin film was fabricated by uniaxial coating on a hydrophobic polyethylene terephthalate substrate. Grazing incidence small-angle X-ray scattering (GISAXS) and transmission SAXS measurements exhibited that the films spontaneously formed uniaxially aligned monodomain-like smectic structures by curing on the hydrophobic substrate. Then, an in- and out-of-plane thermal conductivity of 10 and 0.048 W m(-1) K-1 and outstanding thermal conductivity anisotropy of 208 have been confirmed, respectively. The ME resin films with high thermal conductivity can be applied as insulating materials for multiple-layer electrical and electronic devices.

Automated summary

By fabricating planarly aligned mesogenic epoxy resin film with uniaxially aligned monodomain-like smectic structures, insulating materials with high thermal conductivity and outstanding thermal conductivity anisotropy of 208 have been developed for multiple-layer electrical and electronic devices.