期刊
INTERNATIONAL JOURNAL OF NUMERICAL METHODS FOR HEAT & FLUID FLOW
卷 32, 期 3, 页码 931-943出版社
EMERALD GROUP PUBLISHING LTD
DOI: 10.1108/HFF-03-2021-0158
关键词
Free convection; Engineering applications; Numerical approach; Thermal regulation; Finned vertical cylindrical electronic component; Water-copper nanofluid
资金
- Spanish Ministry of Economy and Competitiveness (Ministerio de Ciencia e Innovacion) [PID2019-109619GB-C21]
The study aims to quantify the free convective heat transfer around a vertical cylindrical electronic component and its cooling with water-based copper nanofluid, proposing a Nusselt-Rayleigh correlation. These findings can be applied to thermal sizing in high power electronics to ensure correct operation under worst conditions.
Purpose The purpose of this study is to quantify the free convective heat transfer around a vertical cylindrical electronic component equipped with vertical fins representing an antenna, contained in a closed cavity maintained isothermal. Its cooling is provided via a water-based copper nanofluid whose volume fraction varies between 0% and 10%. Its effective viscosity and thermal conductivity are determined with the Brinkman and Maxwell models. Design/methodology/approach The governing equation system has been solved by means of the volume control method based on the SIMPLE algorithm. Findings A Nusselt-Rayleigh correlation valid in the 3.32 x 10(5) - 6.74 x 10(7) Rayleigh number range is proposed. It allows the thermal sizing of the considered system used in high power electronics to ensure their correct operation in the worst conditions. Originality/value The proposed correlations are original and unpublished.
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