期刊
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
卷 34, 期 3, 页码 262-269出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TSM.2021.3065553
关键词
Vents; Acoustics; Microassembly; Frequency response; Resistance; Micromechanical devices; Microphones; Acoustic MEMS; characterization; failure modes; low-frequency response; root cause identification
类别
资金
- Engineering and Physical Sciences Research Council through the Centre for Doctoral Training in Embedded Intelligence (CDT-EI) [1799140]
This article investigates the root causes of failures affecting the low-frequency response of MEMS microphones and proposes methods to induce these failures. The information obtained from the frequency response of the devices is insufficient to separate the root causes of failures, but additional information about the circumstances regarding the onset of defects is sufficient for root cause identification.
Frequency response to stimuli applied to acoustic micro-electro-Mechanical Systems (MEMS) yield meaningful information of certain defects affecting such devices. This article presents the effects of three distinct root causes of failures affecting the low-frequency response of MEMS microphones: lid attach holes, die attach holes and broken vents with experimental inductions of these effects for the lid attach holes and broken vents. Methods to create such defects are presented which include laser drilling and focused ion beam machining of holes. A complete characterization of induced broken vents is presented. Alternative locations for defects induction are proposed and demonstrated on 34 devices, 16 with lid attach holes and 18 with induced broken vents. The information obtained from the frequency response of the devices is shown to be insufficient to separate the root causes of failures as their effects on the frequency response is similar and the magnitudes of the variations of the observed response overlap. Additional information about the circumstances regarding the onset of defects such as location of the fault and its occurrence in the device manufacturing/assembly/operation timeline is however sufficient for root cause identification.
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