期刊
IEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCE
卷 43, 期 7, 页码 2193-2205出版社
IEEE COMPUTER SOC
DOI: 10.1109/TPAMI.2021.3075156
关键词
Three-dimensional imaging; computational photography; optical interferometry
资金
- Defense Advanced Research Projects Agency (DARPA) REVEAL [HR0011-16-C-0028]
- National Science Foundation (NSF) CAREER Award [IIS-1453192]
The paper introduces a novel sensor concept that provides high-precision depth measurements by combining different sensing modalities, achieving depth precision up to 35 μm and point cloud densities matching standard CMOS/CCD detectors.
The poor lateral and depth resolution of state-of-the-art 3D sensors based on the time-of-flight (ToF) principle has limited widespread adoption to a few niche applications. In this work, we introduce a novel sensor concept that provides ToF-based 3D measurements of real world objects and surfaces with depth precision up to 35 mu m and point cloud densities commensurate with the native sensor resolution of standard CMOS/CCD detectors (up to several megapixels). Such capabilities are realized by combining the best attributes of continuous wave ToF sensing, multi-wavelength interferometry, and heterodyne interferometry into a single approach. We describe multiple embodiments of the approach, each featuring a different sensing modality and associated tradeoffs.
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