Effect of surface functionalized SiO2 particles filled polyolefin on the dielectric properties of laminates

Dielectric materials play a crucial role in 5G communication technological applications such as printed circuit board (PCB) high-frequency substrate materials. Unfortunately, the fabrication of desirable dielectric performance in organic-inorganic composites is a great challenge because of lack of good interfacial compatibility and uniform dispersion between fillers and polymer. In this work, silicon dioxide (SiO2) was synchronously functionalized by gamma-methacryloxypropyltrimethoxysilane (MPS, s-SiO2) and 1,2-polybutadiene (PB, v-SiO2), which were then used as fillers to fabricate the s-SiO2/polyolefin or v-SiO2/polyolefin laminates. All the v-SiO2/polyolefin laminates exhibited better dielectric, thermal and mechanical properties than those of s-SiO2/polyolefin laminates under the same filler content. Specially, the 50 wt% v-SiO2/polyolefin laminate displays a low dielectric constant (3.42) and loss (3.55 x 10-3) at 10 GHz. Meanwhile, it also shows good stability of dielectric properties in a wide range of high-frequency. This work is conducive to develop laminates with superior dielectric properties and apply to PCB high-frequency substrate field.

Automated summary

This study utilized novel functionalized fillers to fabricate laminates with superior dielectric, thermal, and mechanical properties, with v-SiO2/polyolefin laminates showing better performance suitable for PCB high-frequency substrate applications.