Competitive effect of copper and nickel recovery with carbonate in the fluidized-bed homogeneous granulation process

With the rapid growth of the world's informatics innovation, printed circuit boards (PCBs) processing produces wastewaters with copper and nickel ions. This study aims to remove and recover copper and nickel ions from synthetic PCB wastewater using a fluidized-bed homogeneous granulation process (FBHGP). FBHGP is an advanced green technology that removes copper and nickel and transforms the sludge into a hard granule. The impacts on the removal and granulation of copper and nickel of the initial operating pH, molar ratio (MR) of precipitant to metal, and precipitant flow rate have been evaluated. The highest copper removal was attained at 97% at pH of 6.5 and 98% copper removal at an MR of 2.0 and 10 mL center dot min(-1). A 93% copper granulation was achieved at the same pH, while a 94% copper granulation was also achieved at the same MR and precipitant flow rate. At a pH of 7.5, 85% nickel removal and 74% granulation were attained for a nickel. At an MR of 1.75, 82% and 74% were the highest removal and granulation. While at 25 mL center dot min(-1), the highest removal was 83%, and 73% nickel granulation was achieved. Copper has been successfully recovered from synthetic PCB wastewater using FBHGP. At the same time, nickel needs a multi-step FBR, which is more suitable for the recovery of nickel under the same conditions applied during the same period.

Automated summary

This study investigates the removal and recovery of copper and nickel ions from synthetic PCB wastewater using a fluidized-bed homogeneous granulation process (FBHGP). The research found that high removal and granulation efficiency can be achieved under different operating conditions.