期刊
ENGINEERING STRUCTURES
卷 238, 期 -, 页码 -出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.engstruct.2021.112228
关键词
Suspension bridge; Thermal deformation; Analytical solution; Sag effect; Structural health monitoring
资金
- Hong Kong Polytechnic University [ZE1F]
- Hong Kong Scholars Program [XJ2018062]
- Interdisciplinary Research Project for Young Teachers of USTB (Fundamental Research Funds for the Central Universities) [FRF-IDRY-19-030]
This study derives general and succinct analytical formulas for the thermal deformation of three-span suspension bridges, unifying the deformation of different components through introducing equivalent length and modification coefficients. It is found that the thermal deformation of main- and side-span cables and towers interact with each other, and neglecting the sag effect of side-span cables results in overestimating the thermal deformation.
Deformation of a long-span suspension bridge is mainly caused by ambient temperature changes. The temperature-induced deformation of a bridge is usually calculated using complex three-dimensional finite element analysis, the mechanism of which is often unclear. In this study, we derive general, succinct analytical formulas of the thermal deformation of three-span suspension bridges. The deformation of different components is unified into a one-dimensional thermal expansion formula (?L = LE???T) by introducing an equivalent length LE. The sag effect of side-span cables is characterized by the modification coefficients, which demonstrate that the neglect of the sag effect overestimates the thermal deformation. Furthermore, the thermal deformation of the main- and side-span cables and towers is found to interact with each other as a result of the cable tension changes with varying temperature. The analytical formulas are validated using eight long-span suspension bridges including the Akashi Kaikyo bridge, the longest main-span suspension bridge in the world. The closed-form solutions herein also apply to the self-anchored suspension bridges.
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