Cathodic disbonding behavior of epoxy -Polyamide coating

The present study was done to investigate the effect of coating thickness, the applied potential, immersion time in sodium chloride solution, concentration, temperature, and pH of sodium chloride solution on cathodic disbonding of epoxy -polyamide coating. Analysis of the results obtained regarding the effect of thickness and immersion time on cathodic disbonding of coating showed that mechanism of penetration of water, oxygen, and sodium cations into coating is through cavity. Also, an inverse linear relationship was observed between the applied potential and cathodic disbonding radius of coating. While, increasing concentration of sodium chloride solution in a range of 3.5-5% increased disbonding level of coating, and increasing concentration from 7 to 9% decreased disbonding level. Increasing temperature and pH of sodium chloride solution also elevated cathodic disbonding rate of epoxy- polyamide coating.

Automated summary

The study investigated the effect of various factors on cathodic disbonding of epoxy-polyamide coating, including coating thickness, applied potential, immersion time, sodium chloride solution concentration, temperature, and pH. Results showed a relationship between these factors and the disbonding rate of the coating, with concentration and temperature of the solution having a positive correlation, while applied potential and immersion time had a negative correlation.