Ultrafast dynamics control on ablation of Cu using shaped femtosecond pulse trains

The ablation processes of Cu film are investigated using temporal shaped femtosecond pulse trains. The depth is modulated by changing the number and interval of the sub-pulses. The underlying ultrafast dynamic processes are discussed based on plasma shielding and electron multiple heating mechanisms. When the sub-pulse interval is less than 0.4 ps electron multiple heating is the dominant mechanism, while the plasma shielding dominates the subsequent ablation processes when the sub-pulse interval is larger than 0.4 ps. The curve of depth obtained by three pulse trains shows more significant oscillation as the function of sub-pulse interval under the lowfluence. We propose that the oscillation of depth is due to the coherent phonon oscillation excited by the pulse train. The study provides a basis for giving insight into the ultrafast dynamics for improving micromachining and nano-fabrications using shaped femtosecond pulse trains.

Automated summary

The ablation processes of Cu film using femtosecond pulse trains were studied, showing that electron multiple heating and plasma shielding mechanisms dominate at different sub-pulse intervals. Additionally, significant oscillations in depth were observed under low fluence conditions using three pulse trains.