Effect of the microstructural properties of copper on corrosion performance

The aim of the study was to define the influence of microstructural properties on the electrochemical properties of copper in four different forms: copper in sheet form, copper doped with phosphorus, electroplated copper and copper wire. Open circuit potential and polarization resistance measurements were carried out in order to determine the electrochemical properties and corrosion rates of copper in 0.1 M NaCl solution in oxic conditions at ambient temperature. Statistical evaluation of the electrochemical data was performed in order to differentiate between the various forms of copper samples. Microstructural and electrochemical investigations were combined with electron microscopy and Raman analysis of the corrosion products after immersion of the copper samples in a 0.1 M NaCl solution for 30 days. The various morphologies of copper corrosion products were identified and analyzed by Raman spectroscopy for the various forms of copper.

Automated summary

The study aimed to define the influence of microstructural properties on the electrochemical properties of copper in four different forms, conducting open circuit potential and polarization resistance measurements. Microstructural and electrochemical investigations were combined with electron microscopy and Raman analysis of the corrosion products after immersion of the copper samples in a 0.1 M NaCl solution for 30 days, identifying and analyzing various morphologies of copper corrosion products by Raman spectroscopy.