期刊
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
卷 148, 期 -, 页码 -出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.compositesa.2021.106486
关键词
Polydopamine; Silicon carbide; Dielectric; Mechanical property; Thermal stability
资金
- National Key Research and Development Program of China [2016YFB0302300]
- International Collaboration Programs of Guangdong Province [2020A0505100010]
- Fundamental Research Funds for the Central Universities [2019MS062]
- Natural Science Foundation of Guangdong Province [2021A1515012425]
- Overseas Famous Scholar Funds of Guangdong Province [2020A1414010372]
- City University of Hong Kong [9678103]
- Opening Project of Key Laboratory of Polymer Processing Engineering (South China University of Technology) , Ministry of Education of China [KFKT1904]
In this study, core-shell structured polydopamine functionalized silicon carbide whiskers were successfully synthesized to improve the dielectric properties of the composites. The presence of PDA effectively suppressed the dielectric loss, and the thicker PDA layer contributed to enhancing dielectric breakdown strength and reducing AC conductivity. This simple coated PDA shell strategy could be extended to develop high performance dielectric polymer composites with other inorganic fillers.
Dielectric polymer composites with high dielectric constant and low dielectric loss are highly demanded for various types of devices. In this work, the core-shell structured polydopamine functionalized silicon carbide whiskers (SiC@PDA) were successfully synthesized. The presence of PDA effectively suppressed the dielectric loss of PVDF/SiC@PDA composites because it could inhibit the connection between fillers and reduce the interfacial polarity. Moreover, the thicker PDA layer contributed to improving dielectric breakdown strength and reducing AC conductivity of PVDF composites. The insulating PVDF/SiC@PDA-a-30 composite containing 30 wt % of SiC@PDA-a had a dielectric constant of 35.1 while the dielectric loss still maintained as low as 0.037 at 1 KHz. Meanwhile, PVDF/SiC@PDA-a-30 achieved the maximum stress of 58.8 MPa with elongation at break of 17.3% due to PDA layer improved the compatibility between SiC@PDA and PVDF. This simple coated PDA shell strategy could be extended to inorganic fillers to develop high performance dielectric polymer composites.
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