Criteria for crack path deviation in adhesive layer of bi-material DCB specimen

An alternative to traditional fracture mechanics methodology to predict direction for crack propagation in the adhesive layer of bonded stiff materials is demonstrated. The approach is based on the analysis of the location of maximum of the hoop stress in relation to the existing crack tip. Such method is very convenient and fast as it does not require a lot of computational resources and is easy to implement compared to other known numerical methods dealing with similar problems (e.g. X-FEM). The method is validated by fracture mechanics approach using energy release rate to predict crack propagation direction. The verification is done by using bi-material DCB specimen with relatively thick adhesive layer as an example. After proving the applicability of the maximum hoop stress criterion the parametric study on factors affecting crack propagation in the adhesive layer is carried out. Such parameters as bending stiffness of beams, thickness of the adhesive layer, distance to the bond-line, length of the initial pre-crack are analyzed.

Automated summary

An alternative method based on maximum hoop stress analysis is demonstrated for predicting crack propagation direction in the adhesive layer of bonded stiff materials, avoiding the need for extensive computational resources. Validation is done using fracture mechanics approach, followed by a parametric study on factors influencing crack propagation.