4.8 Article

Biomechanical Energy Harvesters Based on Ionic Conductive Organohydrogels via the Hofmeister Effect and Electrostatic Interaction

期刊

ACS NANO
卷 15, 期 8, 页码 13427-13435

出版社

AMER CHEMICAL SOC
DOI: 10.1021/acsnano.1c03830

关键词

energy harvesting; triboelectric effect; ionic conductive organohydrogel; Hofmeister effect; electrostatic interaction; wearable applications

资金

  1. General Research Fund of the Research Grants Council of Hong Kong Special Administrative Region, China [17206519, 17203520]
  2. HKU-Zhejiang Institute of Research and Innovation (HKU-ZIRI), China

向作者/读者索取更多资源

The use of cryoprotectant replacement method in hydrogels has attracted research interest, but the decrease in conductivity limits their electronic applications. Through the introduction of the Hofmeister effect and electrostatic interaction, a charge channel that is not affected by solvent replacement is built in the hydrogel, leading to improved performance in electronic applications.
The recent use of cryoprotectant replacement method for solving the easy drying problem of hydrogels has attracted increasing research interest. However, the conductivity decrease of organohydrogels due to the induced insulating solvent limited their electronic applications. Herein, we introduce the Hofmeister effect and electrostatic interaction to generate hydrogen and sodium bonds in the hydrogel. Combined with its double network, an effective charge channel that will not be affected by the solvent replacement, is therefore built. The developed organohydrogel-based single-electrode triboelectric nanogenerator (OHS-TENG) shows low conductivity decrease (one order) and high output (1.02-1.81 W/m(2)), which is much better than reported OHS-TENGs (2-3 orders, 41.2-710 mW/m(2)). Moreover, replacing water with glycerol in the hydrogel enables the device to exhibit excellent long-term stability (four months) and temperature tolerance (-50-100 degrees C). The presented strategy and mechanism can be extended to common organohydrogel systems aiming at high performance in electronic applications.

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