期刊
PHOTONICS
卷 8, 期 3, 页码 -出版社
MDPI
DOI: 10.3390/photonics8030079
关键词
fiber-to-chip; silicon photonics; optical interconnects; edge coupler
类别
This study introduces a novel fiber-chip edge coupler approach with a large mode size for silicon photonic wire waveguides, achieved through a multiple structure that allows high coupling efficiency between standard optical fibers and sub-micron silicon wire waveguides. The designed edge coupler is fully compatible with standard microfabrication processes.
Fiber-to-chip optical interconnects is a big challenge in silicon photonics application scenarios such as data centers and optical transmission systems. An edge coupler, compared to optical grating, is appealing to in the application of silicon photonics due to the high coupling efficiency between standard optical fibers (SMF-28) and the sub-micron silicon wire waveguides. In this work, we proposed a novel fiber-chip edge coupler approach with a large mode size for silicon photonic wire waveguides. The edge coupler consists of a multiple structure which was fulfilled by multiple silicon nitride layers embedded in SiO2 upper cladding, curved waveguides and two adiabatic spot size converter (SSC) sections. The multiple structure can allow light directly coupling from large mode size fiber-to-chip coupler, and then the curved waveguides and SSCs transmit the evanescent field to a 220 nm-thick silicon wire waveguide based on the silicon-on-insulator (SOI) platform. The edge coupler, designed for a standard SMF-28 fiber with 8.2 mu m mode field diameter (MFD) at a wavelength of 1550 nm, exhibits a mode overlap efficiency exceeding 95% at the chip facet and the overall coupling exceeding 90%. The proposed edge coupler is fully compatible with standard microfabrication processes.
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