Thermoelectric module design to improve lifetime and output power density

In a traditional thermoelectric is-type module, there is severe thermal stress at the hot side due to the thermal expansion of the hot-side ceramic plate and the mismatch between the coefficient of thermal expansion values among the different components, resulting in the likely development of permeant strain in the module, which leads to short lifetime. In this study, a new module design is proposed to reduce the thermal stress and enhance the lifespan of the module by 68%. Simulation using COMSOL 5.4 Multiphysics software confirmed the advantage. For a given module size, the new design has also a positive effect on the output performance of the thermoelectric module. Such an improvement may be implemented in future module manufacturing for improved performance. (C) 2021 Elsevier Ltd. All rights reserved.

Automated summary

In a traditional thermoelectric is-type module, severe thermal stress reduces lifespan, but a new design can reduce stress, enhance lifespan by 68%, and also improve output performance.