相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples
Thiago Soares et al.
JOURNAL OF ELECTRONIC MATERIALS (2020)
Viscoplastic characterization of novel (Fe, Co, Te)/Bi containing Sn-3.0Ag-0.7Cu lead-free solder alloy
A. M. El-Taher et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2020)
The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering
M. I. I. Ramli et al.
MATERIALS & DESIGN (2020)
Effect of Co content on the microstructure, spreadability, conductivity and corrosion resistance of Sn-0.7Cu alloy
Jianglei Fan et al.
MICROELECTRONICS RELIABILITY (2020)
Influence of graphene content and nickel decoration on the microstructural and mechanical characteristics of the Cu/Sn-Ag-Cu/Cu soldered joint
R. Sayyadi et al.
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T (2020)
Formation and growth of interfacial intermetallics in Sn-0.3Ag-0.7Cu-xCeO2/Cu solder joints during the reflow process
Y. Tang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2019)
Isothermal aging and shear creep behavior of a novel lead-free solder joint with small additions of Bi, Sb and Ni
Q. B. Tao et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2019)
Effect of Bismuth Addition on Physical Properties of Sn-Zn Lead-Free Solder Alloy
Athil Al-Ezzi et al.
JOURNAL OF ELECTRONIC MATERIALS (2019)
Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate
Junghwan Bang et al.
MICROELECTRONICS RELIABILITY (2019)
Growth behavior of IMCs layer of the Sn-35Bi-1Ag on Cu, Ni-P/Cu and Ni-Co-P/Cu substrates during aging
Yulong Li et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2019)
Thermodynamic characteristics, microstructure and mechanical properties of Sn-0.7Cu-xIn lead-free solder alloy
Shuang Tian et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2018)
The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: Review
Shiqian Liu et al.
MICROELECTRONICS RELIABILITY (2018)
Reliability and failure analysis of SAC 105 and SAC 1205N lead-free solder alloys during drop test events
Mei-Ling Wu et al.
MICROELECTRONICS RELIABILITY (2018)
Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7Cu-0.05Ni
J. W. Xian et al.
INTERMETALLICS (2018)
Physical and mechanical properties of synthesized low Ag/lead-free Sn-Ag-Cu-xBi (x=0, 1, 2.5, 5 wt%) solders
Reza Sayyadi et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2018)
Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints
S. A. Belyakov et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2017)
Investigation of microstructure and mechanical properties of Sn-xCu solder alloys
A. F. Abd El-Rehim et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2017)
The effects of antimony additions on microstructures, thermal and mechanical properties of Sn-8Zn-3Bi alloys
Guang Ren et al.
MATERIALS & DESIGN (2017)
In situ imaging of microstructure formation in electronic interconnections
M. A. A. Mohd Salleh et al.
SCIENTIFIC REPORTS (2017)
Nucleation of tin on the Cu6Sn5 layer in electronic interconnections
J. W. Xian et al.
ACTA MATERIALIA (2017)
Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process
M. A. A. Mohd Salleh et al.
JOURNAL OF ELECTRONIC MATERIALS (2016)
Effects of Fe and Bi Minor Alloying on Mechanical, Thermal, and Microstructural Properties of Sn-0.7Cu Solder Alloy
M. H. Mahdavifard et al.
JOURNAL OF ELECTRONIC MATERIALS (2016)
Advances in Pb-free Solder Microstructure Control and Interconnect Design
Kathlene N. Reeve et al.
JOURNAL OF PHASE EQUILIBRIA AND DIFFUSION (2016)
Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification
Xiaowu Hu et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2015)
The effect of undercooling on the microstructure and tensile properties of hypoeutectic Sn-6.5Zn-xCu Pb-free solders
A. A. El-Daly et al.
MATERIALS & DESIGN (2015)
Microstructural and mechanical properties analysis of extruded Sn-0.7Cu solder alloy
Abdoul-Aziz Bogno et al.
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T (2015)
Effects of aging time on the mechanical properties of Sn-9Zn-1.5Ag-xBi lead-free solder alloys
Chih-Yao Liu et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2014)
Board level reliability analysis of chip resistor assemblies under thermal cycling: A comparison study between SnPb and SnAgCu
Changwoon Han et al.
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY (2014)
Microstructure, mechanical properties, and deformation behavior of Sn-1.0Ag-0.5Cu solder after Ni and Sb additions
A. A. El-Daly et al.
MATERIALS & DESIGN (2013)
In-situ study on growth behavior of Ag3Sn in Sn-3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology
H. T. Ma et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2012)
Effects of Ti addition to Sn-Ag and Sn-Cu solders
W. M. Chen et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2012)
Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test
Yanhong Tian et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2012)
Influence of microstructure on quasi-static and dynamic mechanical properties of bismuth-containing lead-free solder alloys
David B. Witkin
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2012)
Surface finish effect on reliability of SAC 305 soldered chip resistors
Maurice N. Collins et al.
SOLDERING & SURFACE MOUNT TECHNOLOGY (2012)
Evolution of the microstructure of Sn-Ag-Cu solder joints exposed to ultrasonic waves during solidification
R. K. Chinnam et al.
ACTA MATERIALIA (2011)
Wetting transition of grain boundaries in the Sn-rich part of the Sn-Bi phase diagram
C. -H. Yeh et al.
JOURNAL OF MATERIALS SCIENCE (2011)
Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints
Richard Coyle et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2011)
Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys with Minor Pb Additions
Maurice N. Collins et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2011)
Comparison of Interfacial Stability of Pb-Free Solders (Sn-3.5Ag, Sn-3.5Ag-0.7Cu, and Sn-0.7Cu) on ENIG-Plated Cu During Aging
Jeong-Won Yoon et al.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES (2010)
Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys
Kazuhiro Nogita
INTERMETALLICS (2010)
Microstructure and In Situ Observations of Undercooling for Nucleation of β-Sn Relevant to Lead-Free Solder Alloys
John W. Elmer et al.
JOURNAL OF ELECTRONIC MATERIALS (2010)
Thermal and mechanical properties of Sn-Zn-Bi lead-free solder alloys
A. A. El-Daly et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2009)
An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics
Weiqiang Wang et al.
JOURNAL OF ELECTRONIC MATERIALS (2009)
Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling
Yanghua Xia et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2008)
Undercooling and microhardness of Pb-free solders on various under bump metallurgies
Moon Gi Cho et al.
JOURNAL OF MATERIALS RESEARCH (2008)
The mechanics of the solder ball shear test and the effect of shear rate
JYH Chia et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2006)
Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn-0.7Cu) on Cu
TY Lee et al.
JOURNAL OF MATERIALS RESEARCH (2002)
分享论文
