期刊
MATERIALS & DESIGN
卷 202, 期 -, 页码 -出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2021.109547
关键词
Atomic force microscopy; Thermomechanical nanolithography; Nanoscale manipulation; Polymer thin film; Nanostructure
资金
- National Natural Science Foundation of China [51705104]
- China Postdoctoral Science Foundation [2018-T110289]
- Heilongjiang Postdoctoral Fund [LBH-TZ1703]
- Youth Talent Support Project of the Chinese Association for Science and Technology
Thermomechanical nanolithography was utilized to manipulate materials at the nanoscale on a polymethyl methacrylate thin film. By controlling scratching velocity and heated temperature, various nanostructures were achieved, including polymer nanowires, nanopit arrays, and nanogrooves. The study demonstrated the feasibility of using stick-slip friction to predict the generation of nanopit structures after calibrating the machining parameters to ensure accuracy.
We conducted thermomechanical nanolithography to realize nanoscale manipulation of materials patterning on a polymethyl methacrylate thin film. We used atomic force microscopy with a heated tip make a single scratch on the film surface. The error in the machining force caused by the thermal expansion of the tip cantilever was corrected to guarantee the accuracy of machining force by calibrating the machining parameters, including the spring constant of the tip cantilever and the sensitivity coefficient of the optical lever for different tip temperatures. Three kinds of nanostructure including polymer nanowires, nanopit arrays, and nanogrooves were regulated via controlling scratching velocity and the heated temperature. Inspection of the nanopit arrays proved that fabrication of continuous bundles with desired dimensions can be realized by controlling the feed between adjacent scratching paths. The good agreement between the calculated stick-slip friction and observed machining outcomes demonstrated the feasibility of using stick-slip friction to predict the generation of nanopit structures. (c) 2021 The Author(s). Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据