相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。MEMS at Bosch - Si plasma etch success story, history, applications, and products
Franz Laermer et al.
PLASMA PROCESSES AND POLYMERS (2019)
Ultra Deep Reactive Ion Etching of High Aspect-Ratio and Thick Silicon Using a Ramped-Parameter Process
Yemin Tang et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2018)
DREM2: a facile fabrication strategy for freestanding three dimensional silicon micro- and nanostructures by a modified Bosch etch process
Bingdong Chang et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2018)
Improving sidewall roughness by combined RIE-Bosch process
Jianyu Fu et al.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2018)
Fabrication of Novel MEMS Microgrippers by Deep Reactive Ion Etching With Metal Hard Mask
Alvise Bagolini et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2017)
Smoothening of scalloped DRIE trench walls
Zishan Ali Syed Mohammed et al.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2017)
Effects of deep reactive ion etching parameters on etching rate and surface morphology in extremely deep silicon etch process with high aspect ratio
Tiantong Xu et al.
ADVANCES IN MECHANICAL ENGINEERING (2017)
Chromium oxide as a hard mask material better than metallic chromium
Ferhat Aydinoglu et al.
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B (2017)
A four level silicon microstructure fabrication by DRIE
S. Rahiminejad et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2016)
A study on separating of a silicon wafer with moving laser beam by using thermal stress cleaving technique
Alias Mohd Saman et al.
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2015)
Effect of process parameters on sidewall damage in deep silicon etch
Lingkuan Meng et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2015)
Smooth silicon sidewall etching for waveguide structures using a modified Bosch process
Feng Gao et al.
JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS (2014)
Aluminum oxide mask fabrication by focused ion beam implantation combined with wet etching
Zhengjun Liu et al.
NANOTECHNOLOGY (2013)
Kinetics of the deposition step in time multiplexed deep silicon etches
Iqbal R. Saraf et al.
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B (2013)
Systematic Approach to Time Division Multiplexed Si Etch Process Development
C. W. Johnson et al.
PLASMA PROCESSING 19 (2013)
Development of Chip Separation Technique for InGaN-Based Light Emitting Diodes
Jae-Hoon Lee et al.
IEEE JOURNAL OF QUANTUM ELECTRONICS (2011)
DRIE fabrication of notch-free silicon structures using a novel silicon-on-patterned metal and glass wafer
Ki Hoon Kim et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2011)
Influence of Bosch Etch Process on Electrical Isolation of TSV Structures
Nagarajan Ranganathan et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2011)
Alumina etch masks for fabrication of high-aspect-ratio silicon micropillars and nanopillars
M. D. Henry et al.
NANOTECHNOLOGY (2009)
An advanced reactive ion etching process for very high aspect-ratio sub-micron wide trenches in silicon
Reza Abdolvand et al.
SENSORS AND ACTUATORS A-PHYSICAL (2008)
Aspect ratio dependent etching lag reduction in deep silicon etch processes
S. L. Lai et al.
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A (2006)
Characterizing and predicting spatial nonuniformity in the deep reactive ion etching of silicon
HK Taylor et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2006)
Maximum achievable aspect ratio in deep reactive ion etching of silicon due to aspect ratio dependent transport and the microloading effect
J Yeom et al.
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B (2005)
Advanced etching of silicon based on deep reactive ion etching for silicon high aspect ratio microstructures and three-dimensional micro- and nanostructures
F Marty et al.
MICROELECTRONICS JOURNAL (2005)
Geometrical pattern effect on silicon deep etching by an inductively coupled plasma system
CK Chung
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2004)
Investigation of fluorocarbon plasma deposition from c-C4F8 for use as passivation during deep silicon etching
CB Labelle et al.
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A (2004)
Critical tasks in high aspect ratio silicon dry etching for microelectromechanical systems
IW Rangelow
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A (2003)
Fabrication of multilevel silicon structures by anisotropic deep silicon etching
R Huber et al.
MICROELECTRONIC ENGINEERING (2003)
Selective and deep plasma etching of SiO2:: Comparison between different fluorocarbon gases (CF4, C2F6, CHF3) mixed with CH4 or H2 and influence of the residence time
F Gaboriau et al.
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B (2002)
分享论文
