The superplastic forming/diffusion bonding and mechanical property of TA15 alloy for four-layer hollow structure with squad grid

The superplastic forming/diffusion bonding (SPF/DB) process has been widely applied to manufacture the multi-layer components. In this paper, a four-layer hollow structure with squad grid was fabricated by SPF/DB process. The superplastic behavior of TA15 alloy was investigated by the uni-axial tensile tests at high temperature, and the maximum elongation of 911 % was obtained at 920 degrees C/0.001 s(- 1). The finite element method (FEM) of the four-layer structure was conducted, and the results showed that TA15 alloy was appropriate for fabricating this complex-shaped structure. Then the four-layer hollow structure was successfully fabricated by SPF/DB process at 920 degrees C with the target strain rate of 0.001 s(- 1). Finally, the microstructure, thickness distribution and mechanical property of the four-layer hollow structure were investigated. The grain size increased from 5 mu m to 10 mu m and the sound bonding interface was achieved. The thickness distribution was symmetrical in height direction. The compressive strength and the maximum bending load of the four-layer hollow structure was 50 MPa and 64.4 kN, respectively.

Automated summary

This paper investigated the fabrication process and results of a four-layer hollow structure using the superplastic forming/diffusion bonding (SPF/DB) process. It was found that the TA15 alloy showed good superplastic behavior at high temperatures, enabling the fabrication of complex-shaped structures with sound bonding interfaces. Additionally, the compressive strength and maximum bending load of the four-layer structure were determined to be 50 MPa and 64.4 kN, respectively.