Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers

In the past years, the use of low silver content SAC0307 (99Sn0.3Ag0.7Cu wt%) solder alloy grew considerably due to its good soldering quality. In the latest version of this alloy, manganese, and bismuth are used to improve further its soldering parameters. In this study, a reliability issue, the whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 solder alloys was investigated. Ultra-thin films (in 100?150 nm thickness) were vacuum evaporated from the investigated alloys onto Cu substrates. The samples were stored at laboratory conditions for 28 days. Whisker growth was followed by a scanning electron microscope, and the ultra-thin film layers structures were investigated in focused ion beam cuts. In the case of the SAC0307-Mn07, the mechanical stress due to the intermetallic layer growth resulted in whisker formation right after the layer deposition. However, Bi addition could increase the stress relaxation ability of the ultra-thin film layer; the whisker formation started only three days after the evaporation in the case of the SAC0307-Bi1-Mn07 layer. Besides, the SAC0307-Bi1-Mn07 alloy could entirely suppress the formation of filament-type whiskers that might cause reliability issues in microelectronics. Furthermore, a unique phenomenon was observed that the SAC0307-Bi1-Mn07 layer produced mostly Bi?Sn whisker couples.

Automated summary

The study found that the addition of bismuth to the SAC0307 alloy can increase the stress relaxation ability of the ultra-thin film layer, delaying the formation of whiskers. The SAC0307-Bi1-Mn07 alloy can completely suppress the formation of filament-type whiskers, reducing reliability issues in microelectronics. Moreover, a unique phenomenon was observed where the SAC0307-Bi1-Mn07 layer mainly produced Bi-Sn whisker couples.