Ultrasonic-assisted electrodeposition of Cu-Sn-TiO2 nanocomposite coatings with enhanced antibacterial activity

Copper-based coatings are known for their high antibacterial activity. In this study, nanocomposite Cu-Sn-TiO2 coatings were obtained by electrodeposition from an oxalic acid bath additionally containing 4 g/dm(3) TiO2 with mechanical and ultrasonic agitation. Ultrasound treatment was performed at 26 kHz frequency and 32 W/dm(3) power. The influence of agitation mode and the current load on the inclusion and distribution of the TiO2 phase in the Cu-Sn metallic matrix were evaluated. Results indicated that ultrasonic agitation decreases agglomeration of TiO2 particles and allows for the deposition of dense Cu-Sn-TiO2 nanocomposites. It is shown that nanocomposite Cu-Sn-TiO2 coatings formed by ultrasonic-assisted electrodeposition exhibit excellent antimicrobial properties against E. coli bacteria.

Automated summary

The study successfully electrodeposited nanocomposite Cu-Sn-TiO2 coatings with dense distribution of TiO2 particles using ultrasonic agitation. These coatings exhibit excellent antimicrobial properties against E. coli bacteria.