期刊
THIN SOLID FILMS
卷 724, 期 -, 页码 -出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.tsf.2021.138598
关键词
Titanium nitride; Magnetron sputtering; Microstructure; Hydrophobicity; Hardness; Adhesion
Titanium nitride films were deposited by reactive magnetron sputtering, showing nanocomposite microstructures with increased hardness and decreased grain size as nitrogen content increased. Films deposited under 20 % N2 exhibited the best performance.
Titanium nitride films were deposited by reactive magnetron sputtering on Si (100) wafers, glass and Ti6Al4V substrates. The film deposition was carried out in a gas mixture of Ar and N2. The nitrogen content was varied between 0 and 30 % of the total gas mixture. This variation led to the formation of different films with different microstructures. The microstructure of the Ti-N coatings presented nanocomposites with a low tendency to surface oxidation. From a pure Ti to tetragonal Ti2N and cubic Ti-N microstructures, the films showed a (111) TiN plane growth that led to an increase in the lattice strain and a decrease in the grain size when increasing the nitrogen flow rate. The water-film contact angle measurements showed that the surface hydrophobicity increased with the increase of nitrogen content in the film. Mechanical properties were measured and a strong dependence between microstructure and hardness was found. The Ti-N deposited under 20 % of N2 exhibited the highest hardness, the best adhesion and wear resistance, and the lowest friction coefficient with the presence of (111) fiber texture.
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