Relationship between Thermal Stability and Structure of MEMS Cantilevers Embedded in an Elastomer

The thermal stability of a micro-electromechanical system (MEMS) cantilever force sensor embedded in an elastomer was examined. When mounting the cantilever on an electronic substrate using solder reflow at 250 degrees C, the elastomer expands against the back of the cantilever. The expansion often breaks the cantilever. The effects of the cantilever thickness and width on the breaking strength and the stress concentration points were simulated by finite clement methods, and the results agreed well with experimental results. This work is expected to improve the thermal stability of MEMS cantilever force sensors by optimizing their design.

Automated summary

The thermal stability of a MEMS cantilever force sensor embedded in an elastomer was examined by studying the effects of mounting on an electronic substrate at 250 degrees C. The research simulated the impact of cantilever thickness and width on breaking strength and stress concentration points, with good agreement between simulated and experimental results. This study is expected to enhance the thermal stability of MEMS cantilever force sensors through design optimization.