期刊
MACROMOLECULAR MATERIALS AND ENGINEERING
卷 306, 期 7, 页码 -出版社
WILEY-V C H VERLAG GMBH
DOI: 10.1002/mame.202100086
关键词
high-frequency flexible circuit boards; low dielectric property; nanocomposite films; polyimides
资金
- Shenzhen Dongyangguang Industrial Development Co., Ltd.
The study developed a low dielectric and high adhesive PI/FEP nanocomposite film, which exhibited excellent mechanical properties and stable dielectric performance in high-frequency circuit boards. The PI/FEP nanocomposite film meets the requirements of the high-frequency flexible circuit board for insulation layer.
The low dielectric polymer films have drawn great attention to the application as the dielectric insulating materials in high-frequency circuit boards, while the weak adhesion to the copper foils and the poor processability resulted from the fluorinated or rigid structures limited their high-frequency application. In this work, the low dielectric and high adhesive polyimide/fluorinated ethylene propylene (PI/FEP) nanocomposite film for high-frequency flexible circuit board application is developed. It is indicated that the fluorocarbon surfactants can significantly improve the dispersion of FEP in PI substrate, and thus, the PI/FEP nanocomposite film exhibits excellent mechanical properties, including the tensile strength increases to 46.6 MPa and the elongation at the break increases to 13.7%. Importantly, at the high-frequency of 10 GHz, the 60 wt% FEP filled PI nanocomposite film displays an ultralow dielectric loss (0.006) and a reduced dielectric constant (2.69). In addition, the high-frequency flexible circuit board with the PI/FEP film as the dielectric insulating layer has a high peel strength of 0.75 N mm-1, indicating this PI/FEP nanocomposite film can meet the requirements of the high-frequency flexible circuit board application.
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