Investigations on continuous-wave laser and pulsed laser induced controllable ablation of SiCf/SiC composites

To lay a foundation for the feasibility exploration of laser-induced ablation-assisted machining for SiCf/SiC composites, combined with numerical simulation and experiments, the laser-induced ablation mechanism of SiCf/SiC composites was studied, and the relationship between laser parameters and ablation depth was analyzed. The laser-induced ablation products of SiCf/SiC composites mainly consisted of recrystallized 3C-SiC and amorphous SiO2, which were powdery and porous. According to the stratification characteristic, the ablation products were divided into attached smoke dust layer, sublimate recrystallization layer, heat-affected layer, and unaffected layer from the surface to the inside of the material. By adjusting the laser parameters (significant factors were the scanning speed and the scanning spacing), the depth of laser-induced ablation was adjustable and controllable. The ablation depth was greater in continuous-wave (CW) mode due to the continuous energy input. Therefore, CW laser is more suitable for generating larger and various ablation depths to match various cutting allowances.

Automated summary

The study investigated the laser-induced ablation mechanism and products of SiCf/SiC composites through numerical simulation and experiments, finding that the ablation depth could be controlled by adjusting laser parameters, with continuous-wave (CW) mode resulting in greater depth. Adjusting the scanning speed and spacing were significant factors in controlling the depth of laser-induced ablation.