Correction

Design, Optimization, and Realization of a High Performance MOEMS Accelerometer From a Double-Device-Layer SOI Wafer (vol 26, pg 859, 2017)

期刊

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
卷 30, 期 2, 页码 331-331

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JMEMS.2020.3048739

关键词

Accelerometers; Microelectromechanical systems; Design optimization

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The content of the article remains unchanged, with only the data of the MOEMS accelerometer listed in Table III being corrected.
In the above article [1], the content of this article remains untouched. Only Table III is rectified. The stiffness of the proposed MOEMS accelerometer listed in Table III should be half of that value, which is 0.56 N/m.

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