4.7 Article

Microstructure and arc erosion behaviors of Ag-CuO contact material prepared by selective laser melting

期刊

JOURNAL OF ALLOYS AND COMPOUNDS
卷 860, 期 -, 页码 -

出版社

ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2020.158494

关键词

Ag-CuO; Selective laser melting; Arc erosion; Contact materials

资金

  1. National Natural Science Foundation of China [51607132, 51807069, 52007137]
  2. Natural Science Foundation of Shaanxi Province [2019-JQ-842]
  3. Graduate Scientific Innovation Fund for Xi'an Polytechnic University [chx2020036]

向作者/读者索取更多资源

This paper investigates the microstructure characteristics, mechanical properties, and arc erosion behavior of Ag-CuO materials prepared by SLM, showing that they exhibit excellent self-repairing characteristics and are suitable for low voltage devices.
In this paper, selective laser melting (SLM) was employed to fabricate the Ag-CuO electrical contact materials with high energy ball milled Ag-CuO composites powders. Microstructure characteristics and arc erosion behaviors of the Ag-CuO material prepared by SLM were investigated. Vickers microhardness and conductivity tests were conducted to determine the mechanical properties of the samples. The make-andbreak testing was carried out to determine the arc erosion behavior of the samples. The experimental results prove that the conductivity and microhardness change little after conducting make-and-break experiments and meet the need for low voltage devices. It was found that the SLM process will produce the holes and cracks of the Ag-CuO sample. However, the SLM Ag-CuO samples show excellent self-repairing characteristics. With the increase of the make-and-break testing, the flow of silver molten pool enhances and repairs the holes and cracks of SLM Ag-CuO samples. Meanwhile, the anti-arc erosion performance was improved during the flow of the arc eroded molten pool enhances. The current research demonstrated that the SLM Ag-CuO samples exhibit potential as electrical contact materials, which will also provide a new idea for the development of contact materials processing. (C) 2020 Elsevier B.V. All rights reserved.

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.7
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据