Computational modeling of thermal characteristics of hybrid nanofluid in micro-pin fin heat sink for electronic cooling

Emerging technology in the electronic industry has led to miniaturization of electronic devices such as iPhones and laptops. Heat dissipation is required to maintain high performance and long-term reliability of these devices. Micro heat sinks and novel working fluids such as nanofluids are becoming popular. Until recent times the full potential of hybrid nanofluid in heat transfer has not yet been exploited. In order to address the lack of adequate modeling data in this field, the aim of this study is to systematically model and investigate computational heat transfer characteristics of Al2O3-Cu/water hybrid nanofluid in micro heat sink. Volume concentration in the range of 0.1%-0.5% was used for the working fluid. Hexagonal micro-pin fin heat sink with staggered arrangement was simulated in ANSYS Fluent. Reliable experimental result from literature was used to validate the accuracy of the results. The most obvious finding to emerge from this study is that the Nusselt number increases with increase in Reynolds number and this observation is consistently the same at different concentrations and pin spacing. Lower transverse pitch was observed to dominate the enhancement of Nusselt number. There was a 10% increase in heat transfer coefficient at 0.5% nanofluid concentration when compared to 0.1%. This phenomenon is highly influenced by the transition of the Re into turbulent situation which eventually enhances the heat transfer characteristics. Also, lower transverse pitch promotes swirling flow situation. At 0.5% hybrid nanofluid concentration, it was observed that the Nusselt number increased from 14.00 at transverse pitch of 3.81 mm to 17.00 at a transverse pitch of 1.81 mm and this corresponds to 16.05% enhancement of Nusselt number. The pressure drop penalty of the working fluid is a result of increase in viscous effect of the hybrid nanofluid, especially at high concentration.

Automated summary

The use of emerging technology in the electronic industry has led to the miniaturization of electronic devices, making heat dissipation crucial for maintaining high performance and reliability. This study systematically modeled and investigated the computational heat transfer characteristics of Al2O3-Cu/water hybrid nanofluid in a micro heat sink, finding that Nusselt number increases with Reynolds number and smaller transverse pitch leads to better heat transfer performance.