期刊
INTERNATIONAL JOURNAL OF FATIGUE
卷 146, 期 -, 页码 -出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.ijfatigue.2020.106132
关键词
SnPb; Solder; Creep-fatigue; Life prediction; Grain boundary sliding
资金
- Ritsumeikan University
This study focuses on the creep-fatigue life prediction of eutectic Sn37Pb solder, with experiments conducted at 313 K using various waveforms. Different prediction rules were used, but a new method based on grain boundary sliding rates was proposed due to its close relationship with creep-fatigue lives.
This study discusses the creep-fatigue life prediction of eutectic Sn37Pb solder. Creep-fatigue lives were experimentally obtained at 313 K using fast-fast, slow-slow, slow-fast, fast-slow, and strain-hold waveforms. Conventional four creep-fatigue life prediction rules, time fraction rule, strain range partitioning method, frequency modified fatigue life, and ductility exhaustion model was used to predict the creep-fatigue lives. However, not all the rules were able to properly estimate them. Since the grain boundary sliding rates were closely related to creep-fatigue lives, a new life prediction method based on grain boundary sliding rates was proposed.
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