Grain boundary sliding model for assessing creep-fatigue life of Sn37Pb eutectic solder

This study discusses the creep-fatigue life prediction of eutectic Sn37Pb solder. Creep-fatigue lives were experimentally obtained at 313 K using fast-fast, slow-slow, slow-fast, fast-slow, and strain-hold waveforms. Conventional four creep-fatigue life prediction rules, time fraction rule, strain range partitioning method, frequency modified fatigue life, and ductility exhaustion model was used to predict the creep-fatigue lives. However, not all the rules were able to properly estimate them. Since the grain boundary sliding rates were closely related to creep-fatigue lives, a new life prediction method based on grain boundary sliding rates was proposed.

Automated summary

This study focuses on the creep-fatigue life prediction of eutectic Sn37Pb solder, with experiments conducted at 313 K using various waveforms. Different prediction rules were used, but a new method based on grain boundary sliding rates was proposed due to its close relationship with creep-fatigue lives.