期刊
IEEE TRANSACTIONS ON POWER ELECTRONICS
卷 36, 期 4, 页码 3735-3743出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TPEL.2020.3024815
关键词
Junction temperature distribution measurement; press-pack insulated gate bipolar transistors (PP IGBTs); sequential V-ce (T) method; thermomechanical coupling
资金
- National Natural Science Foundation of China-State Grid Corporation Joint Fund for Smart Grid [U1766219]
In this article, a sequential V-ce(T) method with separated gate controller is proposed to measure the junction temperature distribution within press-pack insulated gate bipolar transistors (PP IGBTs). The method is integrated into a standard dc power cycling test to validate its applicability and effectiveness. The measured junction temperature exhibits a specific distribution pattern influenced primarily by the deformation of the copper plate.
In this article, a sequential V-ce(T) method with separated gate controller is proposed to measure the junction temperature distribution within press-pack insulated gate bipolar transistors (PP IGBTs), which is not possible for traditional temperature measurement methods due to the enclosed structure and external clamping force of the pressure-type package. This proposed method is integrated into a standard dc power cycling test and the steady-state junction temperature distribution is obtained to validate its applicability and effectiveness. The measured junction temperature exhibited a bathtub type distribution within PP IGBTs. The root cause is the deformation of the copper plate, which was also discussed by the finite-element simulation in previous literature. Furthermore, the influence of static characteristic dispersion is excluded by the chip transposition and the thermomechanical coupling effect is confirmed to be the dominant factor of this junction temperature distribution. Finally, the influence of heating current and heating time on junction temperature distribution is also investigated by the proposed method.
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