期刊
IEEE SENSORS JOURNAL
卷 21, 期 9, 页码 10473-10482出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JSEN.2021.3060281
关键词
Copper; Dielectrics; Films; Capacitive sensors; Sensitivity; Sensors; Plating; Flexible capacitive pressure sensor; cellular structure; 3D printing; sensitivity; dielectric layer
资金
- National Natural Science Foundation of China [51875253]
- Fundamental Research Funds for the Central Universities [JUSRP21910]
The flexible capacitive pressure transducer is a critical soft electronics in wearable consumables and e-skins due to its high sensitivity, mechanical robustness, lightweight, and wearability. The introduction of interfacial microstructure enhances pressure sensitivity, with a new methodology used to fabricate the sensors with optimized copper-plated polyimide electrodes and porous polydimethylsiloxane layer. The impact of geometric complexity on sensitivity, repeatability, and reliability is examined, with a robotic gripper showcasing the ability to control force on soft targets.
Because of high sensitivity, mechanical robustness, lightweight and wearability, flexible capacitive pressure transducer has been widely considered one of the most critical soft electronics in wearable consumables and e-skins. The enhancement of the pressure sensitivity of a flexible capacitive sensor relies on the introduction of interfacial microstructure to the dielectric layer. We demonstrate a new methodology to fabricate flexible capacitive sensors with copper-plated polyimide (PI) films as the electrodes and a porous polydimethylsiloxane (PDMS) layer 3D printed via the direct-ink-writing approach. Time-of-flight secondary ion mass spectrometry is developed to optimize the electroless copper plated PI films. What is further examined is the impact of the geometric complexity of the cellular PDMS structure, including filament width, spacing and alignment, on sensitivity, repeatability and reliability of the developed capacitive sensor. A robotic gripper equipped with our flexible pressure sensor showcases its competence to grip a soft target with well-posed force control. It is expected that our proposed sensor design and manufacturing methodology will advance the development of soft electronics and wearable sensors.
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