Numerical Study of Fluid Flow and Heat Transfer Characteristics in a Cone-Column Combined Heat Sink

Temperature has a great influence on the normal operation and service life of high-power electronic components. To cope with the increasingly severe heat problems in integrated circuits, an enhanced heat transfer factor E is introduced to evaluate the comprehensive heat transfer performance of microchannel heat sinks (MCHS). The computational fluid dynamics (CFD) software was used to numerically study the fluid flow and heat transfer characteristics in the cone-column combined heat sink. The research results obtained the velocity field and pressure field distribution of the heat sink structure in the range of 100 <= Re <= 700. When Re changes, the change law of pressure drop Delta P, friction factor f, average Nussel number Nu(ave), average substrate temperature T, and enhanced heat transfer factor E, are compared with the circular MCHS. The results show that the uniform arrangement of the cones inside the cone-column combined heat sink can change the flow state of the cooling medium in the microchannel and enhance the heat transfer. In the range of 100 <= Re <= 700, the base temperature of the cone-column combined heat sink is always lower than the base temperature of the circular MCHS, and the average Nusselt number Nu(ave) is as high as 2.13 times that of the circular microchannel. The enhanced heat factor E is 1.75 times that of the circular MCHS, indicating that the comprehensive heat transfer performance of the cone-column combined heat sink is significantly better than that of the circular microchannel.

Automated summary

The study introduces an enhanced heat transfer factor E to evaluate the comprehensive heat transfer performance of microchannel heat sinks, and shows that a uniform arrangement of cones in the cone-column combined heat sink can improve the flow state of the cooling medium, enhancing heat transfer. Results indicate that the cone-column combined heat sink has significantly better comprehensive heat transfer performance compared to circular microchannels.