4.6 Article

In situ electrochemical investigation of the interaction between bacteria Xylella fastidiosa DNA and copper(II) using DNA-electrochemical biosensors

期刊

ELECTROCHEMISTRY COMMUNICATIONS
卷 125, 期 -, 页码 -

出版社

ELSEVIER SCIENCE INC
DOI: 10.1016/j.elecom.2021.106975

关键词

Bacterial DNA; DNA-electrochemical biosensor; Pesticide-DNA interaction; Xylella fastidiosa

资金

  1. FEDER funds through the program COMPETE-Programa Operacional Factores de Competitividade
  2. FCT-Fundacao para a Ciencia e a Tecnologia [UID/EMS/00285/2020, UIDB/00285/2020]
  3. CNPq/Brazil [232296/2014-6]

向作者/读者索取更多资源

New emerging bacterial plant diseases are spreading quickly in various geographical regions, with no effective safety measures identified. A Xylella fastidiosa (Xf) DNA-electrochemical biosensor has been developed for the first time, allowing investigation of the Cu(II)-Xf-dsDNA interaction in situ.
New emerging bacterial plant diseases are spreading fast in different geographical regions, and effective safety measures have not been found. Xylella fastidiosa (Xf) is a Gram-negative bacterial plant pathogen classified as a priority quarantine pest, which affects economically important agricultural crops. Although there is no treatment for diseases caused by Xf, copper-based compounds are widely applied to its hosts. A Xf-DNA-electrochemical biosensor based on bacterial DNA from Xf, is reported here for the first time, and the Cu(II)-Xf-dsDNA interaction was investigated in situ. The Cu(II)-DNA interaction was also evaluated using ctdsDNA-, poly[G]- and poly[A]-electrochemical biosensors. The Cu(II)-Xf-dsDNA interaction occurs by Cu(II) binding at different sites, independent of the bacterial DNA sequence, leading to the condensation/aggregation of Xf-DNA strands due to the formation of a rigid Cu(II)-Xf-dsDNA complex structure. Cu(II) did not cause oxidative DNA damage. Resistance of the bacterial Xf-dsDNA to Cu(II) was observed.

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