期刊
CHEMICAL ENGINEERING JOURNAL
卷 410, 期 -, 页码 -出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.cej.2021.128444
关键词
Thermoelectric; Copper implant; alpha-Cu2Se thin films; Crystal structure
资金
- National Natural Science Foundation of China [11604212]
- Guangdong Basic and Applied Basic Research Foundation [2020A1515010515]
- Shenzhen Key Lab Fund [ZDSYS 20170228105421966]
- Electron Microscope Center of the Shenzhen University
Nanocrystalline Cu2Se thin films with uniform element distribution were successfully fabricated in this study, and self-assembled growth of films with desired alpha-phase and well crystallinity was achieved through optimization of annealing temperature. The research revealed that growth orientation is significantly affected by annealing temperature, which in turn affects the thermoelectric properties.
Copper selenide (Cu2Se) is a promising thermoelectric material and alpha-phase Cu2Se provides relatively safe thermoelectric modules for thin film thermoelectric device in contrast to some toxic materials currently on the market. In this work, nanocrystalline Cu2Se thin film with uniform element distribution was fabricated at room temperature through an effective combination reaction method by implanting sputtered Cu+ ions into Se precursor. Then, self-assembled growth of Cu2Se thin films with desired alpha-phase and well crystallinity was successfully achieved with optimization of annealing temperature. Interestingly, the growth orientation has obviously affected by the annealing temperature, which significantly affects the thermoelectric properties. Consequently, the Seebeck coefficients increase with the increase in the orientation factor of the (0l0) preferred orientation, which enhances power factor. The high maximum power factor of 9.23 mu Wcm(-1) K-2 is achieved for alpha-Cu2Se thin film with (0l0) preferred orientation, demonstrating that the method used in this work has great potential in developing low-cost and high-performance thermoelectric thin films from relatively earth-abundant elements.
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