期刊
CARBON
卷 175, 期 -, 页码 20-26出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.carbon.2020.12.079
关键词
Solution-processed; Molybdenum trioxide; Hydrogen-terminated diamond; Surface transfer doping
资金
- Australian Research Council [FT160100207, DE170100164, DP190101864, DP150101673]
- Queensland University of Technology (QUT) through the Centre for Materials Science
The study demonstrates a simple solution-processed method for depositing a MoO3 layer on H-terminated diamond surface to achieve surface transfer doping, leading to a reduction in sheet resistivity and an increase in hole density. The hole accumulation layer induced by sp-MoO3 is thermally stable up to 450 degrees C and exhibits metallic conductivity with strong spin-orbit interaction in the induced 2D surface conducting layer.
The surface of hydrogen-terminated diamond (H-terminated diamond) supports a p-type surface conductivity when interfaced with high electron-affinity surface acceptors through the surface transfer doping process. High electron-affinity transition metal oxides (TMOs), such as MoO3, have been regarded as superior candidates in surface transfer doping of diamond, holding great promise for enabling practical diamond electronic devices. In this work, a simple, solution-processed method is demonstrated to deposit a molybdenum trioxide (MoO3) layer on H-terminated diamond surface to achieve surface transfer doping of diamond. The surface of diamond following the deposition of solution-processed MoO3 (sp-MoO3) experienced significant reduction in sheet resistivity, corresponding to an increase in hole density, compared with the pristine air-doped diamond. This hole accumulation layer induced by sp-MoO3 is thermally stable up to 450 degrees C, and demonstrates metallic conductivity down to 250 mK with a strong spin-orbit interaction (SOI) in the induced two-dimensional (2D) surface conducting layer. Our study demonstrates that sp-MoO3 is comparable with thermally-evaporated MoO3 in doping performance but with great advantage as a simple, inexpensive and highly flexible fabrication method for developing diamond electronics. (C) 2020 Elsevier Ltd. All rights reserved.
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