4.8 Article

Achieving Remote Stress and Temperature Dual-Modal Imaging by Double-Lanthanide-Activated Mechanoluminescent Materials

期刊

ADVANCED FUNCTIONAL MATERIALS
卷 31, 期 25, 页码 -

出版社

WILEY-V C H VERLAG GMBH
DOI: 10.1002/adfm.202101567

关键词

dual– modal imaging; lanthanide‐ activated phosphors; mechanoluminescence; stress sensing; temperature sensing

资金

  1. National Natural Science Foundation of China [51872247, 51832005, 61875136, 11804255, 12074298]
  2. Fundamental Research Funds for the Central Universities [20720200075]
  3. Young Elite Scientists Sponsorship Program by China Association for Science and Technology [2018QNRC001]

向作者/读者索取更多资源

This study presents a novel approach to remote stress-temperature dual-mode sensing, achieved by using a specific material that can read both stress and temperature within the same material. This new technology provides a convenient, reliable, and more sensitive way for developing human-machine interfaces, structural health monitoring, and biomedical engineering applications.
Mechanoluminescence (ML) is one of the most important routes to realize remote sensing of stress distribution, but has never been used in temperature sensing. Traditionally, stress sensing and temperature sensing are separately realized through different methods in multifunctional sensors, which definitely makes the structure more complicated. In this work, the remote stress-temperature dual-modal sensing is proposed by using the double-lanthanide-activated ML material SrZnSO:Tb,Eu, where the stress is read by the integral intensity of ML and the temperature is displayed by the green to red emission ratio (I-Tb/I-Eu) of ML in one material. The dual sensing mode in SrZnSO:Tb,Eu enables building of a new imaging system, providing a facile, reliable, and more sensitive way to remotely visualize the distribution of stress and temperature. It opens up a novel approach to develop advanced artificial skins with simplified structures in human-machine interfaces, structural health monitoring, and biomedical engineering applications.

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