期刊
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
卷 11, 期 -, 页码 1741-1752出版社
ELSEVIER
DOI: 10.1016/j.jmrt.2021.02.003
关键词
Diffusion bonding; High-entropy alloy (HEA); TC4; Interfacial microstructure; Mechanical property
资金
- National Natural Science Foundations of China [51975480, 52075449, 52005410, U1737205]
- China Postdoctoral Science Foundation [2019TQ0263]
- Fundamental Research Funds for the Central Universities [3102019QD0411]
TC4 (Ti-6Al-4V) titanium alloy and Al-5(HfNbTiZr) 95 refractory high-entropy alloy were successfully diffusion bonded at a temperature range of 800-1000 degrees C for 60 min under 5 MPa. The microstructure and mechanical properties of the diffusion bonded joints were investigated, revealing a parabolic growth of reaction zones and an increase in shear strength with bonding temperature. A maximum shear strength of 770.06 MPa was achieved at a bonding temperature of 950 degrees C for 60 min under 5 MPa.
TC4 (Ti-6Al-4V) titanium alloy and Al-5(HfNbTiZr) 95 refractory high-entropy alloy were successfully diffusion bonded at a temperature range of 800-1000 degrees C for 60 min under 5 MPa. The microstructure and mechanical properties of the diffusion bonded joints were investigated. The diffusion bonding seam of the joint contained two different zones, namely: a reaction zone with acicular titanium structures (Zone I); and a continuous solid solution reaction zone (Zone II) which inherited the orientation of the matrix Al-5(HfNbTiZr)(95). The highest microhardness of reaction zone reached 6.82 GPa, located in the boundary of TC4 and the acicular titanium structure zone. The effects of bonding temperature on the microstructure and mechanical properties of the joints were revealed. As bonding temperature increased, all the reaction zones grew in a parabolic manner with an increase in the bonding temperature. The shear strength of the joints ranged from 55.56 MPa to 777.06 MPa as the bonding temperature increased. The maximum shear strength of 770.06 MPa was obtained at a bonding temperature of 950 degrees C for 60 min under 5 MPa, and the fracture located in the TC4 substrate illustrated a typical ductile fracture mode. (c) 2021 The Author(s). Published by Elsevier B.V.
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