期刊
NATURE COMMUNICATIONS
卷 12, 期 1, 页码 -出版社
NATURE PORTFOLIO
DOI: 10.1038/s41467-021-21531-7
关键词
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资金
- CAREER Award from the National Science Foundation (NSF) [DMR-1753393]
- Alfred P. Sloan Research Fellowship [FG-2019-11788]
- Young Investigator Award from the United States Air Force Office of Scientific Research [FA9550-17-1-0149]
- PRF Doctoral New Investigator Award from the American Chemical Society [58206-DNI5]
- Sustainable LA Grand Challenge
- Anthony and Jeanne Pritzker Family Foundation
- National Science Foundation [ACI-1548562]
The new generation of s-BAs thermal interface, manufactured through self-assembly, features high thermal conductivity and excellent elasticity, providing new opportunities in flexible heat dissipation and holding significant promise for electronic thermal management.
Thermal management is the most critical technology challenge for modern electronics. Recent key materials innovation focuses on developing advanced thermal interface of electronic packaging for achieving efficient heat dissipation. Here, for the first time we report a record-high performance thermal interface beyond the current state of the art, based on self-assembled manufacturing of cubic boron arsenide (s-BAs). The s-BAs exhibits highly desirable characteristics of high thermal conductivity up to 21W/m.K and excellent elastic compliance similar to that of soft biological tissues down to 100kPa through the rational design of BAs microcrystals in polymer composite. In addition, the s-BAs demonstrates high flexibility and preserves the high conductivity over at least 500 bending cycles, opening up new application opportunities for flexible thermal cooling. Moreover, we demonstrated device integration with power LEDs and measured a superior cooling performance of s-BAs beyond the current state of the art, by up to 45 degrees C reduction in the hot spot temperature. Together, this study demonstrates scalable manufacturing of a new generation of energy-efficient and flexible thermal interface that holds great promise for advanced thermal management of future integrated circuits and emerging applications such as wearable electronics and soft robotics. Well-developed prototype interface materials for electronics thermal management are limited to a low thermal conductivity or high elastic modulus. Here, the authors report flexible thermal interfaces through self-assembled manufacturing of polymetric composites based on the high thermal conductivity of cubic boron arsenide.
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