4.7 Article

Enhanced flotation efficiency of metal from waste printed circuit boards modified by alkaline immersion

期刊

WASTE MANAGEMENT
卷 120, 期 -, 页码 795-804

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.wasman.2020.11.002

关键词

Waste printed circuit boards; Alkaline immersion; Flotation; Recovery

资金

  1. Jiangsu Natural Science Foundation of Excellent Youth Fund [BK20160055]
  2. Priority Academic Program Development of Jiangsu Higher Education Institutions
  3. Program for the Top Young Talents of Higher Learning Institutions of Hebei [BJ2018201]
  4. Fundamental Research Funds for the Central Universities [3142017104]
  5. National Natural Science Foundation of China [51904301]
  6. Natural Science Foundation of Jiangsu Province [BK20180650]
  7. China Postdoctoral Science Foundation [2020M671652]
  8. 2020 Jiangmen Innovation Practice Postdoctoral Research Project [JMBSH2020B07]

向作者/读者索取更多资源

The study focused on enhancing the flotation efficiency of waste printed circuit boards by alkaline immersion treatment. SEM-EDS analysis revealed complete liberation of metal and nonmetal in the crushed products. By adjusting alkaline immersion time and pH value, a good flotation effect was achieved. XPS analysis showed changes in nonmetal molecular structure, leading to improved dispersion in slurry and increased hydrophilicity. This study offers a new route to enhance the recycling efficiency of waste printed circuit boards.
Efficient recycling of waste printed circuit boards by flotation has become a research focus. In this study, waste printed circuit boards were treated by alkaline immersion to enhance the flotation efficiency. Firstly, the SEM-EDS analysis of the crushed products shown that metal and nonmetal were completely liberated in the -0.25 mm fraction. When the printed circuit boards were modified by alkaline immersion, the recovery of metal increased from 64.34% to 72.35%. Further, the mixture of metal and nonmetal at the edge of nonmetal was discovered by EPMA. This was the cause of metal loss during the flotation process. Secondly, by adjusting the alkaline immersion time and pH value, a good flotation effect was achieved at 40 min alkaline immersion time and the pH = 11. Meanwhile, the XPS analysis of nonmetal found that the intensity of the -OH peak was significantly enhanced, while the intensity of the -O- peak was evidently decreased. The change of the resin molecular structure indicated that the -O- linked to the benzene ring was broken under the action of alkaline immersion, resulting a free bond was generated on the benzene ring. This made the free -OH adsorb to the free bond. This conduct promoted the dispersion of nonmetal in the slurry due to the increased nonmetal surface energy and metal hydrophilicity. Thus, this study provides a new route to improve the flotation efficiency of waste printed circuit boards. (C) 2020 Elsevier Ltd. All rights reserved.

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