Experimental Study of Single Phase Flow in a Closed-Loop Cooling System with Integrated Mini-Channel Heat Sink

The flow and heat transfer characteristics of a closed-loop cooling system with a mini-channel heat sink for thermal management of electronics is studied experimentally. The heat sink is designed with corrugated fins to improve its heat dissipation capability. The experiments are performed using variable coolant volumetric flow rates and input heating powers. The experimental results show a high and reliable thermal performance using the heat sink with corrugated fins. The heat transfer capability is improved up to 30 W/cm(2) when the base temperature is kept at a stable and acceptable level. Besides the heat transfer capability enhancement, the capability of the system to transfer heat for a long distance is also studied and a fast thermal response time to reach steady state is observed once the input heating power or the volume flow rate are varied. Under different input heat source powers and volumetric flow rates, our results suggest potential applications of the designed mini-channel heat sink in cooling microelectronics.