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Suppression of the Backgating Effect of Enhancement-Mode p-GaN HEMTs on 200-mm GaN-on-SOI for Monolithic Integration
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Richard Reiner et al.
IET POWER ELECTRONICS (2018)
Evaluation of novel carrier substrates for high reliability and integrated GaN devices in a 200 mm complementary metal-oxide semiconductor compatible process
S. Stoffels et al.
MRS COMMUNICATIONS (2018)
Channel temperature measurement in hermetic packaged GaN HEMTs power switch using fast static and transient thermal methods
Szu-Hao Chen et al.
JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY (2017)
Electrothermal evaluation of thick GaN epitaxial layers and AlGaN/GaN high-electron-mobility transistors on large-area engineered substrates
Travis J. Anderson et al.
APPLIED PHYSICS EXPRESS (2017)
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Nick Fichtenbaum et al.
IEEE POWER ELECTRONICS MAGAZINE (2017)
Experimental Benchmarking of Electrical Methods and μ-Raman Spectroscopy for Channel Temperature Detection in AlGaN/GaN HEMTs
Vice Sodan et al.
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Review of Commercial GaN Power Devices and GaN-Based Converter Design Challenges
Edward A. Jones et al.
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Steffen Lehmann et al.
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Steve Stoffels et al.
PHYSICA STATUS SOLIDI C: CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 11, NO 3-4 (2014)
Combination of thermal subsystems by use of rapid circuit transformation and extended two-port theory
Y. C. Gerstenmaier et al.
MICROELECTRONICS JOURNAL (2009)
Thermal modeling, analysis, and management in VLSI circuits: Principles and methods
Massoud Pedram et al.
PROCEEDINGS OF THE IEEE (2006)
Thermal conduction in AlxGa1-xN alloys and thin films -: art. no. 073710
WL Liu et al.
JOURNAL OF APPLIED PHYSICS (2005)
Canonical forms of one-port passive distributed thermal networks
L Codecasa
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES (2005)
Generalized image method with application to the thermal modeling of power devices and circuits
N Rinaldi
IEEE TRANSACTIONS ON ELECTRON DEVICES (2002)
Thermal analysis of solid-state devices and circuits: an analytical approach
N Rinaldi
SOLID-STATE ELECTRONICS (2000)