期刊
JOURNAL OF ALLOYS AND COMPOUNDS
卷 853, 期 -, 页码 -出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2020.156958
关键词
Thermal plasma synthesis; Core-shell nanoparticles; W-Cu alloys; Hardness; Electrical conductivity
资金
- National Natural Science Foundation of China [91634118, 11575228, 51534009, 51904015]
- Beijing Natural Science Foundation [2182010]
- National Natural Science Found for Innovative Research Groups [51621003]
- Beijing Municipal High Level Innovative Team Building Program [IDHT20170502]
A new one-step thermal plasma synthesis route was developed to construct core-shell W-Cu nanoparticles with size about 30 nm, addressing the issues of homogeneous elemental distribution and short diffusion distance for Cu to form network around W grains. The synthesized nanocomposite powders facilitated fast densification with uniform microstructure and suppressed W grain growth, resulting in a compact with high relative density and hardness.
In this work, a one-step thermal plasma synthesis route was developed to construct core-shell W-Cu nanoparticles with size about 30 nm. As synthesized nanocomposite powders address the issues of homogeneous elemental distribution and short diffusion distance for Cu to form network around W grains, facilitating fast densification with uniform microstructure and suppressed W grain growth. As a result, compact with high relative density of 99.31% and grain size of 260 nm was obtained at low temperature of 1100 degrees C, further led to the recorded hardness of 562 Vickers-hardness (Hv) and electrical conductivity of 54.32% International Annealed Copper Standard (IACS), respectively. (C) 2020 Elsevier B.V. All rights reserved.
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