Distribution of microencapsulated phase change material on a plate, and inhibited build-up of temperature in response to a constant heat flux

The application of an inorganic phase change material (PCM) on instrument panel for temperature control is reviewed here through numerical simulation. A constant heat flux is provided on one face of the panel, and the inhibited temperature build-up is studied for different modes of PCM placement. The distribution of microencapsulated PCM over the surface of the panel as embedded in the paint layer reduces the temperature gradient that is unavoidable for lumped placement at one location on the panel, which also affects the average temperature. The effect of the size of microcapsules, ranging from mm to mu m scale on characteristics of temperature build-up, is reported here under two different exposure conditions of upper surface of the paint layer, that is, natural convection and fully insulated condition. The cooling characteristics of the panel in the absence of heat flux are presented.

Automated summary

The study evaluates the application of inorganic phase change material (PCM) for temperature control on the instrument panel through numerical simulation, showing a reduction in temperature gradient and an effect on average temperature. The size and placement of microencapsulated PCM affect the temperature build-up characteristics. Different cooling characteristics are observed under two different exposure conditions of the upper surface of the paint layer.