4.7 Article

Analysis and Optimization of Channel Bonding in Dense IEEE 802.11 WLANs

期刊

IEEE TRANSACTIONS ON WIRELESS COMMUNICATIONS
卷 20, 期 3, 页码 2150-2160

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TWC.2020.3041956

关键词

Bonding; Bandwidth; Throughput; Interference; Analytical models; Wireless LAN; Sensitivity; Dynamic channel bonding; spatial reuse; IEEE 802; 11

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Research on channel bonding in IEEE 802.11 wireless LANs has led to the proposal of a new algorithm that enhances the effectiveness of channel bonding in dense network environments, with the predicted performance gains verified through comprehensive simulations.
Channel bonding in IEEE 802.11 wireless LANs is a technique whereby adjacent 20MHz channels are 'bonded' to create a wider bandwidth channel that supports higher data rate transmissions. Although rate improvements due to channel bonding has been shown in sparse wireless LAN environments, its effectiveness in dense scenarios requires further exploration due to increased sensitivity to interference from overlapping co-channel basic service sets. With the newly finalized 802.11ax standard supporting enhanced spatial reuse feature, its impact on the expected gains from channel bonding needs careful analysis. In this work, we propose a new analytical framework that accurately models the performance of channel bonding as a function of both PHY and MAC parameters for a dense network scenario. A new channel bonding algorithm that is robust to overlapped co-channel interference is described, i.e. it preserves channel bonding gains by intelligently choosing the channel bonding bandwidth based on network conditions and parameters that are readily available to all stations, critically the modulation scheme chosen for packet transmission. The predicted gains of the proposed algorithm are verified via comprehensive simulations conducted with the open source network simulator ns-3.

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