期刊
IEEE TRANSACTIONS ON POWER ELECTRONICS
卷 36, 期 2, 页码 1215-1219出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TPEL.2020.3008524
关键词
Average model; modular multilevel converter (MMC); submodule voltage sensor noise (SVSN); switching model
资金
- DOE Power America Program
- Engineering Research Center Shared Facilities - Engineering Research Center Program of the National Science Foundation
- Department of Energy under NSF [EEC-1041877]
- CURENT Industry Partnership Program
The study highlights the importance of considering submodule voltage sensor noise in MMC modeling and proposes a method to improve MMC models by introducing SVSN. Experimental results demonstrate that the proposed model performs well in capturing the impact of SVSN.
The modular multilevel converter (MMC) is a popular topology in medium- and high-voltage applications, and many efforts have been spent on MMC modeling. However, the impact of submodule voltage sensor noise (SVSN), which becomes more severe due to increasing switching speed of power semiconductors and compact submodule design, has not been considered in conventional models. In this letter, the SVSN is introduced by coupling capacitances between the sensor and power stage in an MMC switching model. Furthermore, the SVSN impact is considered in an MMC average model based on derivation of the relationship between the SVSN and the duty cycle. The proposed MMC switching model and average model considering the SVSN are validated by comparing simulations with experimental results in an MMC prototype using 10-kV SiC MOSFETS.
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