Thermal mismatch induced stress characterization by dynamic resonance based on diamond MEMS

We report on the precise measurement of the thermal mismatch induced stress by dynamic resonance method. The metallic electrodes are deposited on a single-crystal diamond microelectromechanical resonator for the Joule heating and stress generation. The results show that the resonance frequency is linearly dependent on the induced stress. The stress resolution in this work is as precise as 10(4) Pa, which is three orders of magnitude better than those obtained by Raman and X-ray diffraction methods.

Automated summary

In this study, the thermal mismatch induced stress was precisely measured using the dynamic resonance method on a single-crystal diamond microelectromechanical resonator. The results indicated a linear relationship between the resonance frequency and the induced stress, with a stress resolution as precise as 10(4) Pa, which is three orders of magnitude better than traditional Raman and X-ray diffraction methods.